Tokyo Electron (TEL) DS1105-200260-12 (N1410200103) AN141003

Product Details

DS1105-200260-12 (N1410200103) AN141003 0050-97418, 0050-97417 0051-04424 Product Description

The Tokyo Electron DS1105-200260-12 Shutter Base (cross-reference: N1410200103 / AN141003 / 0050-97418 / 0050-97417 / 0051-04424) is a precision mechanical interface component engineered for seamless integration within the TEL DS1105 diffusion and oxidation furnace platform. Designed to OEM specification, this shutter base governs the controlled access between the process tube environment and the wafer transfer zone — a function that is critical to maintaining atmospheric integrity, thermal stability, and contamination-free wafer handling across every production cycle.

In high-throughput semiconductor fabs operating 200mm or 300mm wafer lines, the DS1105-200260-12 serves as a foundational mechanical node within the DS1105 system architecture. Its role extends beyond simple mechanical support: it directly influences the repeatability of shutter actuation, the alignment precision of the wafer boat transfer sequence, and the long-term reliability of the furnace tube access mechanism. Any deviation in shutter base geometry or mounting integrity can cascade into process drift, particle contamination events, or unplanned downtime — making OEM-grade replacement parts like the DS1105-200260-12 a non-negotiable requirement for yield-sensitive operations.

The DS1105-200260-12 Shutter Base does not operate in isolation. Within the TEL DS1105 furnace system, it functions as part of a tightly coordinated mechanical and control architecture that spans multiple subsystem layers. Understanding its role requires examining the broader platform context:

At the mechanical actuation layer, the shutter base interfaces directly with the DS1105 shutter assembly and boat elevator mechanism. Components such as the TEL DS1105 boat elevator arm, DS1105 shutter drive motor unit, and DS1105-200260 shutter plate assembly depend on the dimensional accuracy of the DS1105-200260-12 base to maintain repeatable open/close positioning. Misalignment at this layer propagates directly into wafer transfer errors and tube contamination risk.

At the process control layer, the DS1105 platform integrates with TEL's proprietary furnace controller — typically the TEL MK8 or MK8-II process controller — which manages temperature profiling, gas flow sequencing, and shutter actuation timing. The controller's I/O interface communicates with proximity sensors and position encoders mounted on or near the shutter base assembly, making the mechanical integrity of the DS1105-200260-12 a direct input to process control feedback loops.

At the gas and atmosphere management layer, the shutter base sealing interface works in conjunction with the DS1105 tube flange assembly, N₂ purge manifold, and process gas injection system to maintain the required atmospheric boundary between the furnace tube and the transfer module. Degradation of the shutter base mounting surface can compromise this boundary, leading to oxygen ingress or cross-contamination between process zones.

At the wafer handling and transfer layer, the DS1105-200260-12 supports alignment with the TEL DS1105 boat loader, wafer boat support rail, and transfer arm guide assembly. Precise shutter base positioning ensures that the boat transfer sequence executes within the tight tolerances required for high-density wafer stacking and uniform thermal exposure.

At the maintenance and diagnostics layer, the shutter base is a scheduled replacement component within TEL's preventive maintenance (PM) framework. It is typically replaced in conjunction with the DS1105 shutter seal kit, DS1105 O-ring set, and DS1105 proximity sensor calibration kit during major PM intervals. Sourcing OEM-equivalent parts like the DS1105-200260-12 from a verified supplier ensures that PM cycles do not introduce dimensional variance that could affect post-PM qualification results.

The TEL DS1105-200260-12 Shutter Base is deployed across a wide range of semiconductor manufacturing environments where the DS1105 furnace platform is in active production use:

Logic and Memory Fabs: In high-volume DRAM, NAND, and logic device manufacturing, DS1105 furnaces are used for gate oxide growth, field oxidation, and diffusion doping. The shutter base is a critical wear component in these high-cycle-count environments, where furnace utilization rates can exceed 90% and PM intervals are tightly scheduled around production windows.

Power Semiconductor Manufacturing: IGBT, MOSFET, and thyristor production lines rely on DS1105 furnaces for deep diffusion and thick oxide processes. The shutter base must maintain dimensional stability under repeated thermal cycling and mechanical actuation stress in these demanding process conditions.

Compound Semiconductor and Photovoltaic Lines: GaAs, SiC, and thin-film solar cell production facilities operating DS1105 platforms require OEM-grade replacement parts to maintain process repeatability across extended production campaigns.

Research and Pilot Lines: University fabs, national research institutes, and pilot production facilities operating legacy TEL DS1105 equipment depend on reliable spare parts supply chains to sustain equipment uptime without the support of active OEM service contracts.

Refurbished Equipment Integration: System integrators and equipment refurbishers rebuilding DS1105 furnaces for secondary market deployment specify DS1105-200260-12 shutter bases as part of full mechanical overhaul kits, ensuring that refurbished systems meet original OEM performance specifications.

Q1: Is the DS1105-200260-12 compatible with all DS1105 furnace configurations, and does it require any modification for installation? The DS1105-200260-12 Shutter Base is designed to OEM specification for the TEL DS1105 diffusion and oxidation furnace platform and is compatible with standard DS1105 system configurations. No field modification is required for installation in systems that originally specified this part number or its cross-references (N1410200103, AN141003, 0050-97418, 0050-97417, 0051-04424). Installation should follow TEL's DS1105 maintenance manual procedures, including torque specifications and post-installation shutter alignment verification. Our technical team can provide installation guidance and cross-reference confirmation prior to shipment.

Q2: What is the warranty coverage, and how does the 12-Month Warranty apply to this component in a production environment? All DS1105-200260-12 Shutter Base units supplied by NANKMOS are covered by a 12-Month Warranty from the date of shipment. This warranty covers manufacturing defects, dimensional non-conformance, and material failures under normal operating conditions consistent with TEL DS1105 system specifications. The warranty does not cover damage resulting from improper installation, operation outside OEM-specified parameters, or contamination events originating from other system components. Warranty claims are processed with priority support, and replacement units are dispatched with expedited shipping to minimize production impact.

Q3: How does NANKMOS ensure inventory availability and delivery reliability for critical spare parts like the DS1105-200260-12? NANKMOS maintains dedicated inventory buffers for high-demand TEL DS1105 platform components, including the DS1105-200260-12 Shutter Base and its associated assembly parts. All units undergo pre-shipment dimensional inspection and functional verification before dispatch. We support global express shipping with ESD-safe, cleanroom-compatible packaging to ensure parts arrive in production-ready condition. For customers with scheduled PM programs, we offer forward stocking and blanket order arrangements to guarantee parts availability aligned with your maintenance calendar. Contact our team at [email protected] or +86 18359268345 to discuss inventory planning and lead time commitments.